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Thin Film Growth
Thin-film deposition covers any technique for depositing material onto a bulk or thin film substrate. Elemental alloy or compound films are produced by non-reactive or reactive (co-)deposition. Often functionalization or tailoring of device interfaces by predeposition or deposition assisting surface treatment with atoms or ions is necessary.
Using synergies within the Network Of Competence SPECS stands for experienced consultation and design of complete, customized thin film preparation or deposition solutions for all chemical and physical deposition applications. Integration with state-of-the-art surface analysis techniques can easily be realized. SPECS offers robust, highly reliable and precise single components for thin film deposition and surface modification:
- Electron Cyclotron Resonance (ECR) (PCS-ECR and MPS-ECR ) and Radio Frequency (RF) excited plasma cracker sources (PCS-RF ) for surface modification and deposition assisting surface treatment with inert or reactive atom or ion species. The sources can be reconfigured for new applications and be used as plasma source, atom source or ion source.
SPECS is your experienced partner for integrated thin film deposition of advanced device structures.
- Thermal gas cracker source (TGC-H) for pure atomic hydrogen surface treatment.
To all customers of
former Oxford Scientific Ltd.:
SPECS has taken over
the product line of deposition
sources from Oxford Scientific
in 2006, with Dr. Christian Bradley
still involved in the further
development of the sources.
For more information contact us